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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities
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3.12.2026
AI Infrastructure Is Absorbing NAND Supply: TrendForce Now Expects Prices to Surge 85%–90% in Q1 2026
TrendForce expects NAND flash prices to surge up to 90% in Q1 2026 as AI server demand accelerates enterprise SSD consumption and tightens global memory supply.
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3.11.2026
India Expands Semiconductor Push as Micron Sanand Plant Begins Shipping Memory Modules
India accelerates its semiconductor strategy as Micron’s Sanand plant ships its first memory modules while New Delhi seeks equipment investment from Dutch firms.
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3.11.2026
Imec Invests in Atlas Data Storage to Scale DNA Digital Data Storage
Imec and Atlas Data Storage have announced a strategic partnership to accelerate synthetic DNA-based digital data storage. The collaboration combines Atlas’ ASIC and DNA synthesis technology with imec’s semiconductor development, fabrication, and integration capabilities, while imec also takes a direct investment stake in Atlas.
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3.10.2026
Qnity Acquires $61.5 Million Taiwan Semiconductor Facility
Qnity has acquired a $61.5 million semiconductor research and manufacturing facility in Taiwan to support advanced-node and advanced packaging demand, with operations expected in early 2027.
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3.10.2026
UMC and Infineon Sign Supply Chain Decarbonization MoU to Cut Shared Emissions
UMC and Infineon signed an MoU to cut shared supply chain emissions, deepen supplier decarbonization, and advance SBTi-aligned semiconductor sustainability goals.
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3.9.2026
Nvidia Halts H200 Production for China as Export Controls Reshape AI Chip Supply
Nvidia reportedly halted China-bound H200 production and shifted capacity to Vera Rubin, highlighting rising export-control risk and AI hardware sourcing volatility.
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3.9.2026
DENSO Proposes ROHM Acquisition as Japan Power Semiconductor Consolidation Gains Momentum
DENSO has proposed acquiring ROHM in a deal reportedly worth up to about ¥1.3 trillion. Here is what the proposal means for Japan’s power semiconductor market, EVs, data centers, and procurement strategy.
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2.20.2026
FHWA Signals Potential Shift to 100% Domestic Content for Federally Funded EV Chargers
The Federal Highway Administration is considering raising EV charger Buy America requirements from 55% to 100% domestic component cost for Federal-aid highway projects. Comments due March 16, 2026.
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2.20.2026
8-Inch Wafer Tightening: Industrial PMIC, Driver & Discrete Risk (2026)
Market sees 8-inch capacity declining and utilization rising in 2026, with price hikes under discussion. Here’s what it means for industrial BOMs, lead times, and PCN/EOL risk.
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2.18.2026
IBS Analysis: TrendForce Upgrades 1Q26 Memory Price Forecast as Prices Surge
IBS Electronics reviewed TrendForce’s upgraded forecast alongside supplier and market signals to outline what procurement teams should do next.
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