ROHM and Tata Electronics Move Power IC Packaging to India

ROHM Co., Ltd. and Tata Electronics have announced a strategic partnership to establish a semiconductor manufacturing framework in India, starting with advanced chip packaging and testing to support ROHM’s power devices. This partnership is positioned to serve both Indian and global markets, and aligns with India’s broader push to expand domestic electronics manufacturing and semiconductor value-add.

Under the agreement, ROHM will supply device design and process technology, while Tata Electronics will handle assembly, test, and advanced packaging at its Indian facilities. The companies will also jointly market the resulting products through their respective sales channels.

This structure directly targets a persistent supply-chain pressure point. Even when wafer fabrication is secure, packaging and test capacity frequently becomes the gating factor especially for automotive-grade power devices that require tight process control and reliability screening.

First product: automotive MOSFET assembled and tested in India

As a first deliverable, the companies highlighted an India-designed automotive-grade N-channel 100V / 300A silicon MOSFET that will be assembled and tested in India by Tata Electronics.

ROHM has published product details for the device (RJ2P30BBLFRA), including:

• • • 100V Vdss
    • ±300A continuous drain current
    • TOLL package (MO-299)
    • AEC-Q101 qualification (important for automotive reliability expectations)

The companies have indicated mass production shipments are targeted for 2026, which makes this partnership immediately relevant for sourcing and qualification roadmaps this year—especially for automotive programs where PPAP timing and validation cycles can be long.

Power devices remain central to EV and hybrid powertrains, on-board chargers, DC-DC converters, industrial motor drives, robotics, energy storage, inverters, and high-density power supplies for telecom and data infrastructure.

While wafer capacity often dominates headlines, packaging and test determine real-world performance and availability, influencing: thermal efficiency and current handling in compact designs, long-term reliability under heat and vibration, and cycle times that directly affect delivery commitments.

The TOLL package, in particular, is widely used in automotive and industrial designs that demand low resistance, efficient heat dissipation, and scalable board-level assembly.

Tata Electronics has been building out a domestic OSAT (Outsourced Semiconductor Assembly and Test) footprint, including:

• • A commercial OSAT facility in Vemgal, Karnataka (operational since late 2023), and
  • A planned high-volume OSAT site in Jagiroad, Assam, intended to scale packaging and test output significantly over time.l.

What this changes for procurement teams in 2026

This partnership can affect day-to-day sourcing decisions in four practical ways:

1) Shorter and more predictable supply cycles (in-region finishing)

Local packaging and test can reduce logistics friction and improve schedule stability when global freight or customs delays disrupt electronics supply chains.

2) Qualification and change-control will matter

Automotive programs are sensitive to assembly-site changes and teamsshould expect typical diligence: qualification documentation, reliability data, and change notices as supply chains shift.

3) More localization options for India-based manufacturing

For India-based manufacturing or customers with localization preferences, this creates an additional compliance-friendly sourcing option for power devices.

4) Potential for broader portfolio expansion

ROHM and Tata have also signaled interest in higher-value packaging technologies over time. If this extends beyond the initial MOSFET, buyers could see more power devices flowing through India-based assembly and test.