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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities 
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1.6.2026

China Pushes 50% Domestic Chip Equipment in New Fab Capacity

China is requiring chipmakers to use at least 50% domestically made tools for new fab capacity approvals reshaping equipment sourcing, qualification, and supply risk in 2026.
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1.6.2026

Space Forge Generates Plasma in Orbit for GaN& SiC

Space Forge says it generated plasma aboard its ForgeStar-1 satellite, a milestone toward gas-phase crystal growth in orbit for wide bandgap materials like GaN, SiC, AlN and diamond.
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1.5.2026

U.S. Replaces Open-Ended China Fab Access With Annual Licenses for Samsung and SK hynix

The U.S. approved annual 2026 licenses for Samsung and SK hynix to ship chipmaking equipment to China, replacing long-running VEU authorizations with year-by-year review.
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1.5.2026

Copper Prices Hit Record High and Impacts Data Centers

Copper prices surged to record levels in late 2025, raising cost pressure for data centers and semiconductor supply chains. Here’s what engineers and buyers should expect.
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1.5.2026

Foresight Technologies Expands Penang Campus to Boost High-Purity Output

Foresight Technologies is adding an 80,000-square-foot facility in Penang, Malaysia to scale high-purity components and chemical distribution systems for semiconductor manufacturing—doubling regional output and adding 150 jobs.
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12.29.2025

U.S. Delays China-Origin Chip Tariff Hike Until June 2027

The U.S. finalized a Section 301 action on China-origin semiconductors with a 0% rate today and a scheduled increase on June 23, 2027 (rate TBD). What procurement teams should plan for in 2026.

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12.29.2025

Nvidia and Groq Sign AI Inference Licensing Deal 

What initially appeared to be a potential acquisition was later clarified as a licensing agreement alongside leadership hires, leaving Groq’s ownership unchanged.
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12.26.2025

Semiconductor Market Outlook 2026: AI Memory Squeeze, PC Price Hikes, and MLCC Supply Risks

The semiconductor market is on track to approach $1 trillion in 2026, but the operating environment for buyers will be shaped less by top-line growth and more by where capacity is being allocated especially toward AI memory (HBM) and high-spec components used in power delivery and advanced compute.
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12.24.2025

onsemi + GlobalFoundries GaN Deal to Produce 650V Power Devices

onsemi will develop next-generation 650V GaN power devices using GlobalFoundries’ 200mm eMode GaN-on-silicon process, with customer samples targeted for 1H 2026. The announcement highlights how manufacturing scale and platform integration are becoming just as important as device performance for daily procurement planning.
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12.24.2025

SK Hynix Intel-Certified 256GB DDR5 RDIMM Targets Lower-Power AI Servers

SK Hynix says its Intel-certified 256GB DDR5 RDIMM for Xeon 6 can cut power use by 18%. Here’s why that matters for AI infrastructure buyers, qualification cycles, and supply planning.
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